HDPLEX H10.ODD Fanless microATX Case

Cases|Damping
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PHYSICAL DETAILS & POWER SUPPLY

The chassis of the H10 measures 45.0 x 43.8 x 6.0 cm (L x W x H) but we measured the overall dimensions to be 47.6 x 46.2 x 7.2 cm including the faceplate and feet. The case has an internal volume of approximately 11.8 L and weighs about 12 lb.


Like most fanless cases, a series of aluminum fins stick out at the sides to dissipate heat. They are 5.0 mm thick at the base and 3.1 mm at the tip. There is a vent on the top cover above the motherboard and graphics card area.


Being such a slim chassis, there is only room for a single full-height card using a riser expansion slot.


Underneath there are three rows of slot vents underneath the motherboard and screws used to secure drives.


Hex screws are used to install the CPU heatsink and to hold on the 2.4 mm thick top panel. The rest of the case is put together with Phillips heads.


The AC/DC power brick is located inside the case, held on with clamps secured by nuts and bolts. On our sample the clamps had become loose after going through shipping and had to be re-tightened. This is somewhat difficult to do as the nuts are very small.


The power adapter was manufactured by FSP and rated for 150W.


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