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PHYSICAL DETAILS
The HR-01 resembles a shiny, postmodern apartment block from
the '70s. The resemblance may not be intentional, but Thermalright is perfectly
aware of it: The promotional image on the
product page refers to the HR-01 as "High-Riser". (What did you
think HR stands for anyway?)
High-Riser is a good description: The heatsink is very tall.
At nearly 16cm, it's even taller than the Scythe Ninja, edging it out by about a centimeter.
This could pose a problem in narrow cases.
The skyscraper of heatsinks.
The sheer size of the High-Riser almost guarantees that it will perform well,
but it takes more than just size to make a passive heatsink. Other factors are
just as important. For example, the fins need to be spaced widely enough that
the existing system airflow can move heat away from them. Thermalright has done
this, so we have no complaints in this department either.
The fins themselves are quite thick — thicker than they need to be. Although
this keeps the High-Riser quite rigid, it also means the fins could be spaced
a touch further apart if they were thinner. More importantly, the thickness adds a significant amount of
weight.
In comparison to other aftermarket heatsinks, the 525 gram weight is fairly
modest, but still exceeds the 450 gram limit that is recommended by both AMD
and Intel. And, thanks to the extremely tall design, this modest amount of weight
still puts a lot of torsion on the motherboard.
31 widely spaced fins provide ample surface area for heat dissipation.
Because the High-Riser is meant to be used passively, the air that cools it
will not be forced from one end of the fins to the other as it would in a conventional
heatsink. Instead, it will take the path of least resistance. Most of the airflow
can be expected to occur around the edges of the heatsink where there is less
impedance.
Thermalright has done two things to take advantage of this situation:
- Every fin is punctured with about fifty holes that allow
air to travel through the fins themselves as well as between them. This
helps the heatsink deal with situations where the system airflow is not parallel
to the surface of the fins. It also lowers impedance as air tries to pass between the fins.
- The heatpipes are clustered along the sides of the fins where airflow
is likely to be strongest. Heat will be transferred away from the heatpipes
quickly, ideally before it has a chance to saturate the heat capacity of the
fins.
The fins are pockmarked with ventilation holes to encourage airflow in all
three dimensions.
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