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The Spire Fourier IV is a fairly sizeable unit that
immediately brings to mind the Thermaright SI-97 or its larger brethren, the
SI-128. Unlike those comparatives, the Spire is an all-copper model, complete with a 92mm fan. There are four heatpipes that join the fins
to the copper bottom base. The main cooling fins are formed of very thin copper
pieces press fitted onto the heatpipes. The gap between the bottom of the fins
and the top of the base is used for the fan, which is secured to the underside
of the fins with two very easy to use wire clips.
The Spire Fourier IV is a good looking HSF. Shown here with stock fan
and socket 775 mounting hardware. You can see the wave shape profile of
the top edges of the cooling fins,
The side view, without fan or mounting hardware.
It is a big heatsink but because of the way the fan is mounted beneath the fins, it could fit fairly easily in many lower profile cases, such as HTPC cases. Additional clearance of perhaps an inch is needed above the fins for proper airflow, and to avoid turbulence noise, but still it looks promising.
One drawback of copper is that it is substantially heavier than aluminum. Weight is not specified by Spire, but a quick manual comparison against the 665g original Scythe Ninja tells us that this HS is a bit heavier without any fan. 700g is probably a reasonable guess. Add 80-90g for the fan, and we're up to around 800g. This is no lightweight.
Removing the fan and looking straight down shows how thin the
fins are, and how closely they are spaced. The left and right edges of the fins
(as seen in the photo below) are actually closed with a little flap of the fin
that's been bent. As a result, air cannot flow through from any of the sides,
only straight up or down.
Copper is considerably more expensive than aluminum, and generally considered preferable as a heatsink material, as its thermal conductivity is about 50% better. However, copper is only better if there is enough airflow to ensure that the additional heat conducted into the fins can be moved into the air quickly enough. If the bottleneck is airflow, then copper will not show any advantage over aluminum. This usually means a higher airflow, faster, and noisier fan is need to realize the copper fins' cooling advantage. Whether copper fins are really advantageous at the very low airflow that comes along with low fan noise is questionable.
The fin spacing is quite tight, but the fins themselves are very thin.
The Base and Mounting Clips
The photo of the base below shows it's not that smooth. There
are many coarse machining lines which can be both seen and felt without much
difficulty. It is quite flat, however. One of the two fan clips can also be seen.
It requires open flange corners on the fan.
A "ledge" formed by a notch on the ends of the fins is used for the fan wire clip.
The mounting hardware for each of the different types of CPU sockets gets screwed
to the four threaded holes in the corners of the base. The photo below shows
the socket 775 hardware in place.
With 775 socket mounting hardware installed.
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