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THE BASE & INSTALLATION
The base is the first conduit of heat transfer, so logically
it should be the most efficient piece of the puzzle. A flat base is ideal
unless the manufacturer decides to match CPU heatspreader curvature.
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We found the base to be very flat and it did indeed have a mirror coating
as Thermaltake claimed.
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Installation on AMD systems is faciliated using a simple tension clip
which fits in two grooves running perpendicular to the heatpipes. It's
a very common design.
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For LGA775 boards, a pair of push-pin brackets are attached using four
screws. We're not fond of this system but for lighter heatsinks it isn't
too much of a concern. Surprisingly, we found the heatsink weighs only
520 grams compared to the 667 grams listed in the specifications.
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The SpinQ installed on our LGA775 test platform. The blower fan generates
airflow in a 360 degree arc parallel to the fins. In the above orientation
(which corresponds to how most AMD sockets are arranged), the fan pushes
air towards the top and bottom of the board. It also creates signficant
top-down airflow on the VRMs at the edge of the board and the northbridge
heatsink. If the heatsink is positioned with fins parallel to the PCI
slots, the VRMs near the rear of the board and the memory modules would
receive extra cooling.
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