ThermalTake SpinQ: Unique Blower-fan Heatsink

Cooling
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THE BASE & INSTALLATION

The base is the first conduit of heat transfer, so logically it should be the most efficient piece of the puzzle. A flat base is ideal unless the manufacturer decides to match CPU heatspreader curvature.


We found the base to be very flat and it did indeed have a mirror coating as Thermaltake claimed.



Installation on AMD systems is faciliated using a simple tension clip which fits in two grooves running perpendicular to the heatpipes. It's a very common design.



For LGA775 boards, a pair of push-pin brackets are attached using four screws. We're not fond of this system but for lighter heatsinks it isn't too much of a concern. Surprisingly, we found the heatsink weighs only 520 grams compared to the 667 grams listed in the specifications.



The SpinQ installed on our LGA775 test platform. The blower fan generates airflow in a 360 degree arc parallel to the fins. In the above orientation (which corresponds to how most AMD sockets are arranged), the fan pushes air towards the top and bottom of the board. It also creates signficant top-down airflow on the VRMs at the edge of the board and the northbridge heatsink. If the heatsink is positioned with fins parallel to the PCI slots, the VRMs near the rear of the board and the memory modules would receive extra cooling.



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