Thermaltake BigTyp 14Pro: A Bigger Typhoon

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Before thermal testing, we took some basic physical measurements.

Thermaltake BigTyp 14Pro: Approximate Physical Measurements
790 g (heatsink alone)
820 g (including LGA775 mounting clips)
Fin thickness
0.30 mm
Fin spacing
1.42 mm
Vertical Clearance
Horizontal Overhang
20 mm (measured from the edge of the heatsink to the top edge of our test motherboard's PCB)

Comparison: Approximate Fin Thickness & Spacing
Fin Thickness
Fin Spacing
Zalman CNPS9300 AT
0.17 mm
Zalman CNPS9900 LED
0.24 mm
Scythe Ninja
0.31 mm
3.95 mm
Scythe Ninja 2
0.39 mm
3.68 mm
Thermalright HR-01 Plus
0.45 mm
3.15 mm
Noctua NH-U12P
0.44 mm
2.63 mm
Noctua NH-C12P
0.47 mm
2.54 mm
Xigmatek HDT-S1283
0.33 mm
1.96 mm
Zerotherm Zen FZ120
0.37 mm
1.80 mm
Thermaltake SpinQ
0.31 mm
1.67 mm
Thermalright Ultra-120
0.45 mm
1.42 mm
Thermaltake BigTyp 14Pro
0.30 mm
1.42 mm

Testing was done according to our unique heatsink testing methodology, and the included fan was profiled using our standard fan testing methodology. A quick summary of the components, tools, and procedures follows below.

Test Platform change:
Due to the amount of wear and tear to which we subject this test platform (which we also use for hard drive testing) it was decided to replace the motherboard with a newer, more current model that could be easily replaced should it be damaged.
Asus kindly provided us with two P5Q-EM's — one will be kept as a spare in case anything happens to the original. Testing showed that the CPU temperature reported by SpeedFan on the new motherboard was exactly what it produced on our original platform. The hard drive was also replaced with a solid state drive — the system now has no moving parts aside from the products we evaluate.

Key Components in Heatsink Test Platform

  • Intel Pentium D 950 Presler core. TDP of 130W; under our test load, it measures 78W including efficiency losses in the VRMs.
  • Asus P5Q-EM motherboard. A microATX board with integrated graphics and short solid-state capacitors around the CPU socket, and a diminutive northbridge heatsink for maximum compatibility.
  • Intel X25-M 80GB 2.5" solid-state drive.
  • 1GB of Corsair XMS2 DDR2 memory. 2 x 512MB PC2-8500.
  • FSP Zen 300W fanless power supply.
  • Arctic Silver Lumière: Special fast-curing thermal interface material, designed specifically for test labs.
  • Nexus 120 fan (part of our standard testing methodology; used when possible with heatsinks that fit 120x25mm fans)

Measurement and Analysis Tools

  • Seasonic Power Angel for measuring AC power at the wall to ensure that the heat output remains consistent.
  • Custom-built, four-channel variable DC power supply, used to regulate the fan speed during the test.
  • PC-based spectrum analyzer: SpectraPlus with ACO Pacific mic and M-Audio digital audio interfaces.
  • Anechoic chamber with ambient level of 11 dBA or lower
  • Various other tools for testing fans, as documented in our standard fan testing methodology.
  • SpeedFan, used to monitor the on-chip thermal sensor. This sensor is not calibrated, so results are not universally applicable.
  • CPUBurn P6, used to stress the CPU heavily, generating more heat than most real applications. Two instances are used to ensure that both cores are stressed.
  • Throttlewatch 2.01, used to monitor the throttling feature of the CPU to determine when overheating occurs.

Load testing was accomplished using CPUBurn to stress the processor, and the graph function in SpeedFan was used to make sure that the load temperature was stable for at least ten minutes. The stock fan was tested at various voltages to represent a good cross-section of its airflow and noise performance.

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