LGA775 Low Profile Heatsink Roundup

Cooling
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TESTING

Testing was done according to our unique heatsink testing methodology, and the included fan was profiled using our standard fan testing methodology. A quick summary of the components, tools, and procedures follows below.

Key Components in Heatsink Test Platform

  • Intel Pentium D 950 Presler core, C1 stepping. TDP of 95W; under our test load, it measures 78W including losses in the VRMs.
  • Asus P5Q-EM motherboard. A microATX board with integrated graphics and short solid-state capacitors around the CPU socket, and a diminutive northbridge heatsink for maximum compatibility.
  • Intel X25-M 80GB 2.5" solid-state drive.
  • 1GB of Corsair XMS2 DDR2 memory. 2 x 512MB PC2-8500.
  • FSP Zen 300W fanless power supply.
  • Arctic Silver Lumière: Special fast-curing thermal interface material, designed specifically for test labs.

Measurement and Analysis Tools

  • Seasonic Power Angel for measuring AC power at the wall to ensure that the heat output remains consistent.
  • Custom-built, four-channel variable DC power supply, used to regulate the fan speed during the test.
  • PC-based spectrum analyzer: SpectraPlus with ACO Pacific mic and M-Audio digital audio interfaces.
  • Anechoic chamber with ambient level of 11 dBA or lower
  • Various other tools for testing fans, as documented in our standard fan testing methodology.
  • SpeedFan, used to monitor the on-chip thermal sensor. This sensor is not calibrated, so results are not universally applicable.
  • CPUBurn P6, used to stress the CPU heavily, generating more heat than most real applications. Two instances are used to ensure that both cores are stressed.
  • Throttlewatch 2.01, used to monitor the throttling feature of the CPU to determine when overheating occurs.

Load testing was accomplished using CPUBurn to stress the processor, and the graph function in SpeedFan was used to make sure that the load temperature was stable for at least ten minutes. The stock fan was tested at various voltages to represent a good cross-section of its airflow and noise performance.

Physical Measurements

Physical Measurements
Heatsink
Height
Fan Diameter
Fin Thickness
Fin Separation
Weight
Alpine 7 GT
64 mm
74 mm
0.44 mm
2.6 mm
280 g
Intel Aluminum
63 mm
77 mm
varies
varies
330 g
Intel Q6600
62 mm
82 mm
varies
varies
440 g
Thermolab Micro Silencer
58 mm
85 mm
0.43 mm
1.4 mm
270 g
Scythe Big Shuriken
57 mm
113 mm
0.32 mm
1.3 mm
420 g
Intel Q9550
45 mm
79 mm
varies
varies
260 g
Thermolab Nano Silencer
39 mm
76 mm
0.38 mm
1.5 mm
210 g



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