AMD's 785G Chipset Boards: 780G Evolved

CPUs|Motherboards
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Cooling

Lower cost boards ship with simple heatsinks on the Northbridge and Southbridge while those targeted at enthusiasts typically have large heatpipe coolers and heatsinks on the voltage regulation modules near the CPU socket. A well-cooled motherboard can deliver better power efficiency and stability.

Heatsink Temperatures
Heatsink
Southbridge
Northbridge
VRM
MSI 785GM-E65
50°C
64°C
61°C
Asus M4A785TD-V
57°C
70°C
61°C
Asus M4A78T-E
50°C
85°C
63°C
DFI 790GX-M3H5
60°C
86°C
80°C
Measured with a spot thermometer at the hottest point of each heatsink after 15 minutes of full CPU + GPU load.
CPU fan reduced to 8V.

The MSI 785GM-E65 was easily the winner in our thermal testing. Its chipsets measured 6-7°C than Asus' board which makes sense considering the board's lower power consumption. The heatsinks on both boards were fairly cool by relative standards. Cooling isn't an issue on either.

3D Performance

To get a rough estimate of how well each board's integrated graphics plays games, we ran 3DMark05/06. As synthetic benchmarks they have limited value, but they give a rough idea of how well an IGP performs.

3D Performance: Futuremark Comparison
Motherboard
Graphics
3DMark05
3DMark06
Asus M4A78T-E
HD 3300
4884
2205
Asus M3A78-T (AM2+)
HD 3300
4699
2140
Asus M4A785TD-V
HD 4200
4095
1789
MSI 785GM-E65
HD 4200
4067
1765
256MB of VRAM assigned to IGP
(128MB Sideport + 128MB UMA).

The HD 3300 IGP on the 790GX chipset is still a faster chip, posting a 17% and 22% advantage in 3DMark05/06 respectively over HD 4200. Taking into account our previous results with the 780G chipset and X2 4850e processor, after extrapolation/scaling, we estimate HD 4200 has cut the difference in half, sitting right between HD 3200 and HD 3300.



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