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Cooling
Lower cost boards ship with simple heatsinks on the Northbridge and Southbridge
while those targeted at enthusiasts typically have large heatpipe coolers and
heatsinks on the voltage regulation modules near the CPU socket. A well-cooled
motherboard can deliver better power efficiency and stability.
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Heatsink Temperatures
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Heatsink
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Southbridge
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Northbridge
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VRM
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MSI 785GM-E65
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50°C
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64°C
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61°C
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Asus M4A785TD-V
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57°C
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70°C
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61°C
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Asus M4A78T-E
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50°C
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85°C
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63°C
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DFI 790GX-M3H5
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60°C
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86°C
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80°C
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Measured with a spot thermometer at the hottest point
of each heatsink after 15 minutes of full CPU + GPU load.
CPU fan reduced to 8V.
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The MSI 785GM-E65 was easily the winner in our thermal testing. Its chipsets
measured 6-7°C than Asus' board which makes sense considering the board's
lower power consumption. The heatsinks on both boards were fairly cool by relative
standards. Cooling isn't an issue on either.
3D Performance
To get a rough estimate of how well each board's integrated graphics plays
games, we ran 3DMark05/06. As synthetic benchmarks they have limited value,
but they give a rough idea of how well an IGP performs.
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3D Performance: Futuremark Comparison
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Motherboard
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Graphics
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3DMark05
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3DMark06
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Asus M4A78T-E
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HD 3300
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4884
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2205
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Asus M3A78-T (AM2+)
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HD 3300
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4699
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2140
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Asus M4A785TD-V
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HD 4200
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4095
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1789
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MSI 785GM-E65
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HD 4200
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4067
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1765
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256MB of VRAM assigned to IGP
(128MB Sideport + 128MB UMA).
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The HD 3300 IGP on the 790GX chipset is still a faster chip, posting a 17%
and 22% advantage in 3DMark05/06 respectively over HD 4200. Taking into account
our previous results with the 780G chipset and X2 4850e processor, after extrapolation/scaling,
we estimate HD 4200 has cut the difference in half, sitting right between HD
3200 and HD 3300.
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