Posted: Sat Feb 13, 2010 7:14 am
Another development in the D510MO & T3310 story...
I suppose a good case for the D510MO would have nothing obstructing airflow between the heasink and a large vent when the board is positionned vertically. Which cases would qualify besides the T3500 sent to SPCR?
For what that's worth, I'm currently running LXDE on the current i386 Rawhide and I've connected a USB optical drive, a mouse and 100M ethernet. I'm not seeing significant (>2C) temperature differences between BIOS screens, memtest or Linux (maybe the drivers are not idling all the components properly).
And I'll close this update with another question for the experts (should one show up): is there some rule of thumb to estimate how much higher the board's temperatures would get if the ambient temperature was higher. I guess it's a bit less than +1C per +1C but maybe not.
That seems to have been a mistake. Intel said one would get better cooling by having airflow along the largest dimension of the heatsink but I didn't think convection would create much airflow there. Apparently, I was wrong: temperatures have dropped shortly after I positioned the case vertically on its stand. The case is poorly suited for that because the power supply must be heated by the airflow from the board and because the ATX cable is obstructing airflow (perhaps I could tie it out of the way somehow). Still, reported temperatures have dropped about 13 and 10 degrees to 37C and 54C (21C ambient). At least a hard drive would be out of the way of the warm air in that position.HFat wrote:After laying it horizontally ...
I suppose a good case for the D510MO would have nothing obstructing airflow between the heasink and a large vent when the board is positionned vertically. Which cases would qualify besides the T3500 sent to SPCR?
For what that's worth, I'm currently running LXDE on the current i386 Rawhide and I've connected a USB optical drive, a mouse and 100M ethernet. I'm not seeing significant (>2C) temperature differences between BIOS screens, memtest or Linux (maybe the drivers are not idling all the components properly).
To answer another of my questions, according to Intel's technical product specification, it is between the heatsink and the edge of the board, in the "processor voltage regulator area". Intel says its temperature can rise up to 85C in an open chassis. Interestingly, it also gives 99C for the processor (perhaps that can be approached when the GPU as well as the CPU are stressed but I'm skeptical as this heatsink is doing a good job) and 113C for the NM10 chip (the one which hurt me when I pressed my finger against it yesterday).HFat wrote:Does anyone know where the "remote" sensor is located?
And I'll close this update with another question for the experts (should one show up): is there some rule of thumb to estimate how much higher the board's temperatures would get if the ambient temperature was higher. I guess it's a bit less than +1C per +1C but maybe not.