Thermalright Archon SB-E 15cm Fan CPU Cooler
Posted: Sun Jun 17, 2012 8:25 pm
Discussions about Silent Computing
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https://www.silentpcreview.com/forums/viewtopic.php?f=13&t=64555
So according to SPCRs measurements it fits and you have a whole 2mm spare!CPU heatsink up to 17.4 cm tall
If you're referring to the pic of the CPU with TIM on it, that's not necessarily after the Archon was mounted on it; it could have been taken before the TIM was cleaned off after the last HD tested.LBXAC20 wrote:If you look at the bottom of page2 http://www.silentpcreview.com/article1271-page2.html at the heatsink imprint pattern, it looks like the base is convex to a siginificant degree.
Yes thats right a slight convex warp would be ideal in most cases, however, it seems that sometimes TR heatsinks bow out too much. I can only speak for myself and x-bitlabs also seemed to have issue with this. My situation was so bad that about 60% of the heatspreader was entirely left without TIM, and temperatures were worse than the stock intel heatsink, after a quick lapping though, everything behaved as it should. Naturally I'm not saying the Archon definitely has this problem its just something that bothered me when I saw the pic of the imprint posted in the article.MikeC wrote:If you're referring to the pic of the CPU with TIM on it, that's not necessarily after the Archon was mounted on it; it could have been taken before the TIM was cleaned off after the last HD tested.LBXAC20 wrote:If you look at the bottom of page2 http://www.silentpcreview.com/article1271-page2.html at the heatsink imprint pattern, it looks like the base is convex to a siginificant degree.
If the TIM imprint pattern was indeed that of the Archon, our results suggest that it did not hurt the performance in the least.
Thermalright intends its bases to be slightly convex, to match the slightly concave shape of most heatspreaders on CPUs, both Intel and AMD. I've checked about 10 CPU samples, and all but one of them have a very slightly depressed center, which can be seen by holding a good metal straight edge across the top of the CPU and holding it to a light (or window) -- the gap is easily visible.
I've got a True Spirit 140 (which is the same height as the Archon original) in a SOLO II and I use the TY-141 fan which already sticks out above the heatpipes, at least the way I mounted the fan.lb_felipe wrote:Great review as usual.
I have a question: Does its height exceed the clearance limit of Antec SOLO II?
That is most likely a misconception. The laws a physics simply answer your issue. If TIM "migrates" outwards that is because of the laws of physics, a few hours later the same laws of physics still apply, so your question has nothing at all to do with the laws of physics. Unless you come up with some "evidence" to the contrary you, and your post(s) will be ignored by the majority. NOTE: TIM "is supposed to be squashed out" that's its whole damned point".Another theory of mine, which might be completely unscientific and wholly incorrect, but one I observed in how my system behaved was that when you've got a convex heatsink mount pushing away the TIM, it might not initially manifest itself in higher temps, but rather after a few hours of use, when TIM will migrate outwards as a result of the pressure. This could explain why temperatures might initially look good but later on start to worsen.
Do you happen to know whether the first Solo has the same width?SebRad wrote:From Solo II Review page 4So according to SPCRs measurements it fits and you have a whole 2mm spare!CPU heatsink up to 17.4 cm tall
A misconception or not, I saw this behaviour multiple times when mounting and remounting my heatsink now you can explain it how you want if that theory isn't according to your liking but the fact remains that my temperatures were initially ok and then steadily worsened over a few hours. I don't know where the laws of physics come into the equation all I said was that i think that it gets pushed out over a period of a few hours and not necessarily immediately. Yeah and I understand that TIM is supposed to be squashed out but when theres no TIM on your heatspreader and heatsink right underneath the die and most of the heatsink is also barren of TIM and the TIM is peeling out into the socket ( even though only a little has been used) I think that isnt exactly ideal. To be clear i saw a 15C drop in IBT @ stock 3570k speeds, and more when overclocked. Forget the theory if you want, the fact remains that if you have a sink that is too convex and/or a cpu heatspreader that is also misshapen (in a way that doesn't 'fit' the bow in the heatsink) you will have an unoptimal cooling solution...I thought that much is accepted as general knowledge and that is the real point I'm trying to make.andyb wrote:That is most likely a misconception. The laws a physics simply answer your issue. If TIM "migrates" outwards that is because of the laws of physics, a few hours later the same laws of physics still apply, so your question has nothing at all to do with the laws of physics. Unless you come up with some "evidence" to the contrary you, and your post(s) will be ignored by the majority. NOTE: TIM "is supposed to be squashed out" that's its whole damned point".Another theory of mine, which might be completely unscientific and wholly incorrect, but one I observed in how my system behaved was that when you've got a convex heatsink mount pushing away the TIM, it might not initially manifest itself in higher temps, but rather after a few hours of use, when TIM will migrate outwards as a result of the pressure. This could explain why temperatures might initially look good but later on start to worsen.
Andy
PS: I hope that you/your posts are not ignored.
I experimented with TIM and I experimented with different pressures and mounting directions, nothing made a real difference until I lapped it.MikeC wrote:TIM is supposed to form a super thin layer, just enough to fill any voids in the interface between HS and CPU. Most also harden at least somewhat over repeated heat/cool cycles; it doesn't stay in liquid form.
We've reviewed a dozen or more TR heatsinks over the years, and I don't recall ever seeing less than excellent performance from the vast majority of them, nor of their performance changing over any period of time. I'm not positive that TR has employed this convex base design all that time, but certainly for some years.
If you found an improvement with lapping, well that's good, but I wonder what other factors were in play? There are a few, potentially --
-- less than ideal tightening of HS to CPU (for whatever reason)
-- too much/little TIM
Finally, sure, you could have had a sample with too convex a base -- or a CPU with a really flat or even convex heatspreader -- anything is possible.
Plus it would be more secure when moving the caseMikeC wrote:If you don't mind living a bit dangerously, the tip of the heatpipes caps touching or even pressing a bit against the side cover should not be detrimental -- the extra pressure and heat conduction might even help w/cooling.
The stock fan sticks out way above the heatsink so if anything you'll be hitting the fan not the heatpipes. It might not be as ideal because it could dislodge the fanclips if you're unluckyMikeK wrote:Plus it would be more secure when moving the caseMikeC wrote:If you don't mind living a bit dangerously, the tip of the heatpipes caps touching or even pressing a bit against the side cover should not be detrimental -- the extra pressure and heat conduction might even help w/cooling.
I just wanted to post this because I'm just amazed at seeing another Lawrence Lee. It's rare enough to meet another person named Lawrence, but seeing it with my last name too?!!!Lawrence Lee wrote:http://www.silentpcreview.com/Thermalright_Archon_SBE
vlee wrote:Will this heatsink and fan combo fit inside a Silverstone FT02 case? (my google-fu was unable to confirm)
Also, I can only find the dual-fan Thermalright Silver Arrow SB-E variant online. Hopefully that performs at least as well as the reviewed unit and can fit in a Silverstone FT02 case.
SilverStone states that it doesn't fit:Still, our main caution is about size. At 172 mm, it's one of the tallest heatsinks on the market, too tall for even for fairly big ATX cases. By our measurements, its height exceeds the clearance limit of popular noise-conscious cases like the Corsair Obsidian 550D, Fractal Define Mini, SilverStone Temjin TJ08-E, and Cooler Master Silencio 450/550.
However I surprised the fact that the FT02 doesn't appear to be incompatible in the review, although it has not been cited as compatible.Limitation of CPU cooler: 165mm