the article below, cool master claims their combo of vapor and heat pipes outperforms low-end water cooling http://www.slashgear.com/cooler-master- ... -20210196/
Other than designing a short form factor cooler, I guess there is one other use for a vapor chamber... that is if amount of heat that needs to be moved from the surface of the CPU to the fins is greater than the capacity of traditional heatpipes to move it.
My observation is that this is not the gating factor. In fact if you see where the technical prowess competition is occurring it is in removing the heat from the heat pipes into the fins and then into the air.
If heat transfer from the CPU surface to the heatsink were the real source of the problem we would see other high-end manufacturers, of much greater prowess than Coolermaster using vapor chambers. It isn't fancy technology... it is just a heat pipe of a different shape.
One con to a single massive vapor chamber I can imagine is that if it goes bad... you have real problems. If instead one of your 6 heatpipes goes bad.... it is unlikely to be a catastrophic event.
I believe that only real advantage to watercooling that overcomes the disadvantage of the extra noise of the pump, the extra complexity and the extra cost... is that it can move larger quantities of heat to the air. No matter what... all heat sinks do is to transfer heat to the ambient temperature air.... from both the CPU and the video card.
But they overcome the gating factor by moving more ambient temp air through larger fin arrays. It doesn't seem to me that anyone has any problems removing the heat from the surface of the CPU. The real problems appear to be how you move that heat into the ambient air.
Though I must admit this is all conjecture. But it seems to make sense to me.
this is what guru3d says
Cooler Master TPC 812 vapour chamber CPU cooler
By Hilbert Hagedoorn, January 14, 2012 - 11:07 PM N/A
Cooler Master has a vapour chamber CPU cooler on display at CES 2012. The TPC 812 has a copper base, six U-shaped copper heatpipes, a vapour chamber block in the middle, an aluminium fin array and a 120PWM fan.
The HSF uses the same fan bracket as the V6 and newer Hyper coolers, and supports Intel's new LGA2011 socket.
According to Cooler Master, the TPC 812 can handle over 240W of heat and performs close to or better than entry-evel single-radiator watercooling kits. Pricing is said to be around the $100 mark though, which seems quite excessive.
I wouldn't be surprised if it is exaggeration, but what if future thermalright and thermaltake etc., start using combo of vapor+heatpipe.
re: the problem you identify, I know this would be insanely expensive, though probably not more expensive than a water cooling kit, but why not have flattened heat pipes as the fins to cool off?
in otherwords, instead of heatpipe + fins, why not just heatpipes like a tree with smaller heatpipes branching off as the branches. a cooler that is entirely made of heatpipes