I still think that with CPU's marching towards 100w/sq.cm., we are approaching the crunch with respect to metal heat sinks. The copper jobbies, like the ones reviewed in Mike's first roundup (slk800 et al), they are all advanced designs that show the results of intelligent maximization of principals. Problem is, metal don't move heat fast enough. The high power electronics industry is already on the path of isothermal heat spreaders, and for good reason. I think we are sitting near the apex of metal heatsink performance, and that heatpipe/phase change technology is the only reasonable future. I just want to see the products, which exist, but have not been tailored for and made available to our market yet.
In the mean time things like this Taisol and the Coolermaster HHC-001 are sound but perhaps inadequate/half way attempts at an end target. I bet that getting the heat up out of the middle of the spreader base with heatpipes should indeed help alleviate the hot spot effects of a solid metal base, and give a thermally short path to a larger less heat congested fin area, but I still doubt that either of these products is much more than a stepping stone. And I curse Taisol for not putting all three pipes out the same side. I imagine bending that upper section upright to 90 deg., ducted out, pushed by a Panaflow. Alas, 'tis not to be