So, ok, I think I've pretty much decided that I will have to glue my Zalman NB32J heatsink to the Northbridge of my Gigabyte 8IHXP (Intel 850E)--this mobo uses the "clip" retention design and not the more common "pin."
Now the question is whether I use the thermal adhesive (2 tubes) provided by Zalman or go out for the more expensive stuff like Arctic Silver 3 Thermal Adhesive. So,
1) Would the Arctic Silver 3 Thermal Adhesive be better for attaching my NB heatsink?
2) When I attach the heatsink, I just apply a small amount of the thermal adhesive to the die (raised rectangular portion of the actual chip) of the i850E, correct? The Zalman instructions use an illustration of a totally flat-surfaced northbridge chip...
Your help is greatly appreciated!
Arctic Silver 3 Thermal Adhesive
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