FrostyTech reports: "Diamond thermal paste? Yup, the penultimate material for thermal conductivity has been turned into thermal paste by Scottish company called Electrospell. Electrospell's Thermodime‚ĄĘ diamond heat transfer compound is an ultra high thermal conductivity thermal interface material composed of pure surface-modified diamond microcrystals (1-micron diameter) suspended in a special carrier fluid." Several times higher rate of heat transfer over conventional TIM is claimed. - Discuss this news in the SPCR forum.