DIAMOND-based heat transfer compound

Internet News

FrostyTech reports: "Diamond thermal paste? Yup, the penultimate material for thermal conductivity has been turned into thermal paste by Scottish company called Electrospell. Electrospell's Thermodimeâ„¢ diamond heat transfer compound is an ultra high thermal conductivity thermal interface material composed of pure surface-modified diamond microcrystals (1-micron diameter) suspended in a special carrier fluid." Several times higher rate of heat transfer over conventional TIM is claimed. - Discuss this news in the SPCR forum.