Thermalright SI-97A for both K7 & K8!
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Thermalright SI-97A for both K7 & K8!
Here.
Looks a lot like the XP-90, but the fins doesn't go all the way down to the base. It even got the same dimensions, but the weight is only 280 g. Maybe it would have been better (at least for ducting) if the upper part were vertical, just like a Shuttle ICE heatsink.
Good to see new socket A and S370 heatsinks entering the market!
Edit #1: Changed the title to get the attention without making a new thread and spreading the discussion....
Edit #2: New model SI-97A! Fits socket 370, 462, 754, 939, 940.
Looks a lot like the XP-90, but the fins doesn't go all the way down to the base. It even got the same dimensions, but the weight is only 280 g. Maybe it would have been better (at least for ducting) if the upper part were vertical, just like a Shuttle ICE heatsink.
Good to see new socket A and S370 heatsinks entering the market!
Edit #1: Changed the title to get the attention without making a new thread and spreading the discussion....
Edit #2: New model SI-97A! Fits socket 370, 462, 754, 939, 940.
Last edited by Mats on Mon Mar 27, 2006 6:08 am, edited 4 times in total.
What on earth did they do that for?
I don't get this design at all. It's completely heatpipe dependant, yet it has the fan blowing onto or away from the base.
The weight is good though, and besides that one peculiarity, it is a proven design. If it's cheaper than it's cousins, it should be a good deal, and I think I might get one.
I think it could be modded by welding a passive cooler to the base. Like maybe an old orange zalman northbridge heatsink(NB32?), but with the pins bent out in all directions.
Ed , is there any way you can find out if they are going to use the Stock retention clip as it seems to be light enough .
I have been trying to find a cooler for an XP3200+ on an Asus A7N8X - VM400 as it has IDLE temps of 55 deg.C with the stock cooler . There have not been a lot of higher end coolers for AMD boards without the holes.
I have been trying to find a cooler for an XP3200+ on an Asus A7N8X - VM400 as it has IDLE temps of 55 deg.C with the stock cooler . There have not been a lot of higher end coolers for AMD boards without the holes.
My guess:
If you look at the base of the Si-97, there's a flat spot in the short little fins that protrude from it. That flat area looks to be in the right spot, and be the right size, for a clip retention spring to mount over.
Don't know any reason why they wouldn't use the clips...its lighter than some of their other clip-mounted heatsinks.
I have some curiousity about whether mounting orientation will have an effect on performance....one way or another, the "hot" end of half the heatpipes is going to end up being mounted above the "cold" end. (unless you have a desktop case)
If you look at the base of the Si-97, there's a flat spot in the short little fins that protrude from it. That flat area looks to be in the right spot, and be the right size, for a clip retention spring to mount over.
Don't know any reason why they wouldn't use the clips...its lighter than some of their other clip-mounted heatsinks.
I have some curiousity about whether mounting orientation will have an effect on performance....one way or another, the "hot" end of half the heatpipes is going to end up being mounted above the "cold" end. (unless you have a desktop case)
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They probably use the same type of heatpipes as in the XP-120. So it won't matter. See the revisions MikeC made to the XP-120 review after remarks in the discussion thread about it.Rusty075 wrote:[...]I have some curiousity about whether mounting orientation will have an effect on performance....one way or another, the "hot" end of half the heatpipes is going to end up being mounted above the "cold" end. (unless you have a desktop case)
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Looks to me they didn't really think it through. The primary usefulness of a heatpipe is to move the heat farther away from the source. They do that, but then they have the fan blowing the heat right back down to the CPU.
If I get one, I'd probably try bending the heatpipes so that the side profile is an L (like a HS from a Shuttle SFF) instead of a sideways U. Then it could be used with a fan blowing parallel to the motherboard surface rather than down aginst it or up from it. If the CPU socket is oriented right, an exhaust case fan might be enough.
If I get one, I'd probably try bending the heatpipes so that the side profile is an L (like a HS from a Shuttle SFF) instead of a sideways U. Then it could be used with a fan blowing parallel to the motherboard surface rather than down aginst it or up from it. If the CPU socket is oriented right, an exhaust case fan might be enough.
That's great to hear, if it sucks at blowing, that should drive the price down. I guess this is why the XP's work rather well with the fan sucking.MikeC wrote:Looks to me they didn't really think it through. The primary usefulness of a heatpipe is to move the heat farther away from the source. They do that, but then they have the fan blowing the heat right back down to the CPU.
Maybe the final version will be different, like at least a bit tilted, they could do that since it's no longer connected to the base. Hopefully it's only like this because it's made from XP-90 parts.
I like that idea, especially as you could position the fins right up against the exhaust fan with the right mobo/case (or use a short duct)MikeC wrote:If I get one, I'd probably try bending the heatpipes so that the side profile is an L (like a HS from a Shuttle SFF) instead of a sideways U. Then it could be used with a fan blowing parallel to the motherboard surface rather than down aginst it or up from it. If the CPU socket is oriented right, an exhaust case fan might be enough.
But would it be possible to bend heatpipes without cracking them or compromising their efficiency? I don't know how bendable they normally are, has anyone tried it with any other heatpipes?
I want to try and reverse the fan so it blows upwards as my intended use is in a rather small micro ATX mini tower (InWin V450a ) on an Asus A7N8X -400VM board and it looks like it will almost reach the Case door just add a foam plastic gasket and a side vent and all the heat is outside the case - The CPU is an XP3200+ and runs at 45 to 50 deg C, just surfing the web with the stock cooler - Currently it is running a TT Golf 325 which gets good temps with a 2000 rpm fan(an educated guess)but is utter cr*p with an undrvolted LI fan -
so the Thermalright HAS to be an improvement even in the worst case possible .
Please Note -: for the TT supporters out there that I am not knocking the Golf 325 it is a very good heatsink with a Panaflo M with a 27 watt resistor (voltage unknown & exact speed unknown) and is not terribly noisy but definately NOT a candidate for silent computing ( I bought it because A. it was the cheapest heatsink I could get B. it was available locally on the day I needed a heatsink .)
so the Thermalright HAS to be an improvement even in the worst case possible .
Please Note -: for the TT supporters out there that I am not knocking the Golf 325 it is a very good heatsink with a Panaflo M with a 27 watt resistor (voltage unknown & exact speed unknown) and is not terribly noisy but definately NOT a candidate for silent computing ( I bought it because A. it was the cheapest heatsink I could get B. it was available locally on the day I needed a heatsink .)
Ed and Mike: after the regular testing is completed, might the tester try bending the radiator section 90 degrees? If much resistance is felt, a little assistance could be supplied by a heat gun.
Or not: from efcoins' post in another thread: "Heatpipes rupture at about 150C, less if they have bends in them, DO NOT HEAT THEM"
Or not: from efcoins' post in another thread: "Heatpipes rupture at about 150C, less if they have bends in them, DO NOT HEAT THEM"
I believe with a little engineering and creativity it would be possible - but how much and what kind of advantage would there be against just having the fan on top and blowing upwards .I'm thinking about mounting a fan under the heatsink and having it blow up and out of case side duct... in theory, this way the fan will have less interference on the intake, and the heat will be evacuated from the case directly. Would this be workable?
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IMO, none. The disadvantage is higher impedance - on both sides of fan instead of just one, so higher noise.pony-tail wrote:I believe with a little engineering and creativity it would be possible - but how much and what kind of advantage would there be against just having the fan on top and blowing upwards .I'm thinking about mounting a fan under the heatsink and having it blow up and out of case side duct... in theory, this way the fan will have less interference on the intake, and the heat will be evacuated from the case directly. Would this be workable?