Zalman 7000: is low pressure between HSF and CPU a problem?!

Dance123 · Post by **Dance123** » Sat Jun 28, 2003 9:48 am

Hi,

In this review http://www.lostcircuits.com/advice/zalman_cnps7000/ they mention that the Zalman 7000 has low pressure between the HSF and the CPU. Why is this a problem, to which problems could this possibly lead, like HSF falling off or something?!..

Does the Zalman 6500B-AlCu have the same problem, as I am still doubting between the 6500 or 7000 model?!

Thanks in advance for all help!

Mike.

herosformula · Post by **herosformula** » Sat Jun 28, 2003 10:54 am

The retaining mechanism used to hold down the 7000 flower does not have a accurate positioning system, so you can move the HS around on the processor, but I have not noticed any problems associated with it. My old HS was the 6500 with the original 4 screw (take off the Intel cage) mounting system which was very precise and secure. The 7000 maintains temperature similar to the older design, but is quieter.

rpc180 · Post by **rpc180** » Sun Jun 29, 2003 3:26 pm

Also, the 6500B series has a problem with the plastic clips losing tension due to heat after a few months. The 7000 has aluminum clips so it doesn't have this problem.

Will_Corrigan · Post by **Will_Corrigan** » Sun Jun 29, 2003 7:22 pm

rpc180 wrote:Also, the 6500B series has a problem with the plastic clips losing tension due to heat after a few months.

It's important to note that for some time now, Zalman has been shipping the 6500B series with metal reinforcers which effectively eliminate the aforementioned problem.